Features and Benefits
Z-Axis Signal Connectors
The Packaging Solution for Z-Axis interconnection
- As chip structures are minimized and board interconnection densities are maximized, growing into the third dimension is the logical progression in packaging efficiancy
- To meet this demand, Hypertac Interconnect has developed a Z-axis interconnect module especially suited for high speed applications in harsh environments
- The HyperStac, based around the new RFF contact technology, offers a highly reliable and compact packaging solution for high density interconnections between low spacing parallel boards
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Number of Rows
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Custom
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Pitch
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1.905 x 1.524
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Contact Positions
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Up to 999
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Contact Termination
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Solderless compression contact
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Nominal Current
(A)
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1 A
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Nominal Pin Dia
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0.3 FF
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Qualifications
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ESA-ESCC 3401/076