Features and Benefits
High density PCB connectors
- Termination style: Wire wrap (AWG 28-30), solder bucket (AWG 22-24-26), through board solder (0,5,mm ø termination)
- Used in civil and military aeronautic programmes
- Pitch: alternated of 1,27mm between contacts and 1,905 between rows
- Accessories: guiding devices with or without polarization (16 keys available)
- High density interconnection
- Low contact insertion
- Low contact resistance
- 5000 mating and unmating cycles
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Number of Rows
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3
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Pitch
-
2,54
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Contact Positions
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1 to 162
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Contact Termination
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Right angle through board solder, Straight through board solder, Solder bucket, Wire wrap
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Nominal Current
(A)
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3A
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Nominal Pin Dia
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0,5
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Qualifications
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ESCC 3401 039 NF C-UTE C93-424