This makes the HyperStac the world's first solderless connector for PCB packagings to be ESA qualified. Specially designed for severe environment applications, it uses the patented low profile 2 loop wire contacts RFF, exclusive to Hypertac.
The HyperStac connector has already been used successfully in several space programmes such as the Pleiade observation satellites and the Inmarsat telecommunication satellites. In addition to its very compact size (1.905mm pitch and contact height of 7.8mm) and its easy connection, the HyperStac ensures a full continuity of contact even in the harshest environments. It has just obtained the ESA qualification after passing the most stringent of all tests which reproduces the maximal vibration conditions during take-off of rockets. The connector was successfully tested under 3-directional vibrations of 20g during 30 mns, without any nanocuts occurring.
The HyperStac is designed for all types of micro-electronics applications requiring reliable and compact packaging solutions: interconnection of MCMs (MultiChip Module) to PCBs, MCM to MCM, PCB stacking, etc. It meets the needs of the military electronic market (missile computers, fighter aircrafts, UAVs, Future Soldier equipment, etc), avionics (radars and digital control boxes, etc) and space market (launchers, satellites, space vehicles, etc).
The key to the high performance of the HyperStac connector is Hypertac's proprietary solderless contact technology RFF, made of a double elastic wire loop, ensuring 4 different points of contact. Its very low contact resistance makes it ideally suited for micro-currents. The spring ensures the necessary compression on the modules to be interconnected. The combination between the elastic wire loop and the compression spring guarantees a total continuity of contact, as acknowledged by its ESA qualification. The HyperStac connector offers a mechanical deflection of up to 1.2mm which compensates for surface tolerances between the modules whilst maintaining the continuity of contact.
Thanks to its adaptable geometry, the HyperStac connector can be adapted to any type of packaging: MCM, square, rectangular, and is also available in strips of different sizes (30 contacts or more).
Hypertac pursues its programme of research and development and is currently working on an even higher density connector for the civil avionics market, with a pitch of 1mm and a contact height of 3mm.
Hypertac has been an ESA qualified supplier for more than 25 years.
ABOUT HYPERTAC
Hypertac, a part of Smiths Interconnect, is a leading supplier of high reliability, high performance interconnect solutions and electrical/electronic connectors. The company has particular expertise in the rapid development of innovative interconnect solutions for high reliability applications in military, aerospace, industrial, mass transit, test & measurement and medical electronics markets.
The Hypertac range includes printed circuit board connectors, modular, rectangular, filtered ARINC and circular connectors. Hypertac connectors achieve outstanding performance through the use of patented Hyperboloid contacts.
Hypertac hyperboloid contact is an advanced design that satisfies the most demanding performance requirements. The shape of the contact sleeve is formed by wires strung at an angle to the socket axis. When the pin is inserted into the sleeve, the wires stretch around it, providing a number of linear contact paths. This ensures high reliability, a high number of mating cycles, shock and vibration immunity, low contact resistance and low insertion and extraction force.
ABOUT SMITHS INTERCONNECT
Smiths Interconnect, part of the global technology business Smiths Group, designs and manufactures specialized electronic and radio frequency products that connect, protect and control critical systems for the wireless telecommunications, aerospace, defense, space and medical markets. For further information visit: www.smithsinterconnect.com